High Purity Molybdenum Plate

High Purity Molybdenum Plate
Product Introduction:
Product Name:High Purity Molybdenum Plate
Brand Name:TIHRJ
Standard: ASTM B388/ASME B31.1
Application:Chemical and Electronics Industry
Place of Origin:Shaanxi Baoji China
Packaging :Wooden Packages
Payment Terms:T/T, Trade Assurance,L/C
Type Of Shipping:By air/ By ocean /By railway
Certificates: ISO 9001:2015/EN10204 3.1 MTC/EN10204 3.2 MTC
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Description
Technical Parameters

Advantages And Limitations Of Molybdenum Plate

 

Advantages:

1. Excellent high temperature resistance

Molybdenum sheet has a melting point of up to 2620 °C and can maintain high strength above 1200 °C, making it an ideal choice for high-temperature components such as vacuum furnace heating elements and aerospace nozzles.

2. Excellent thermal and electrical conductivity

Its electrical conductivity is about 30% that of copper, but it has outstanding arc erosion resistance and is often used in high-voltage electrical contact materials.

3. Strong corrosion resistance

It has good corrosion resistance to molten glass, liquid metal and most acids, and its life in glass manufacturing furnaces far exceeds that of ordinary steel.

4. Low coefficient of thermal expansion

The thermal expansion rate is only 1/3 of that of copper, and it has a high degree of compatibility with ceramic materials, and is widely used in semiconductor packaging substrates.

 

Shortcoming:

1. Difficult to process

The brittleness is significant at room temperature, and it needs to be rolled in a high-temperature environment (>800 °C), and the equipment cost is more than 40% higher than that of ordinary metals.

2. Oxidation sensitivity

It is easy to oxidize to form MoO3 volatiles above 600°C, which requires argon protection or surface coating, which increases the complexity of the process.

3. Limited economy

The concentration of molybdenum ore resources (China accounts for 56% of the world's reserves) and the high refining purity requirements (more than 99.95%), resulting in the price of the finished product being 8-10 times that of 316 stainless steel.

 

The Production Process Of Molybdenum Plate

 

1. Preparation of raw materials

Powder metallurgy method is adopted: molybdenum powder (particle size 2-5μm) is isostatically molded (pressure 200-300MPa) and sintered at 1600-1800 °C under hydrogen protection to obtain a density >92% molybdenum billet.

2. Hot rolling forming

The blank is preheated to 1200-1400°C and gradually thinned through multiple passes of rolling (10-15% deformation per pass), during which repeated annealing is required to eliminate work hardening.

3. Cold rolling finishing

After the temperature is reduced to room temperature, precision rolling is carried out using a four-high rolling mill, which can produce thin plates with a thickness of 0.02-3mm and a surface roughness of up to Ra0.8μm.

4. Surface treatment

Pickling (nitric acid + hydrofluoric acid mixture) to remove the oxide layer, or magnetron sputtering to coat a 50μm aluminum coating to improve oxidation resistance.

 

The Core Application Field Of Molybdenum Plate

 

1. Electronics industry

Semiconductor manufacturing: used as a heater for sapphire crystal growth furnace (purity > 99.95%), the thermal field temperature uniformity error is <± 2°C.

Display panel: High purity molybdenum target (99.99%) is used for TFT-LCD thin film deposition with a sputtering rate of 300nm/min.

2. High-temperature equipment

Vacuum furnace heating element: molybdenum plate processed into U-shaped components, the working temperature can reach 1800 °C, and the service life is more than 2000 hours.

Monocrystalline silicon furnace heat screen: multi-layer molybdenum plate structure makes the radial temperature difference in the furnace < 5°C.

3. In the field of nuclear energy

As a fast neutron reactor control rod material, the molybdenum-98 isotope has a low neutron absorption cross section (2.4 target en), ensuring the long-term operation of the reactor.

4. Special welding

Molybdenum-copper composite plate (containing 30% Cu) is used for rocket engine nozzle welding, the thermal conductivity is increased to 180W/(m·K), and the thermal shock resistance is increased by 3 times.

 

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